# pcb-rnd User Manual: Appendix

## 9.6 Glossary

### Useful terminology for a common vernacular

This glossary is under construction. It currently combines terms that focus pertain to any of the following facet subjects.

1. pcb-rnd specific terminology
2. pcb manufacturer terminology
3. pcb CAD layout and design terminology
4. CAD/graphics common design terminology

We will fill in definitions, continue to add terms, and determine an appropriatly faceted method to index the terms.

Combined Glossary Table
term | description | facets
--- | --- | ---
5/5 | 5mil minimum traces & 5mil minimum spacing
6/5 | 6mil minimum traces & 5mil minimum spacing
AMC | aluminum metal core

ACY

additive

Adhesive

Altium

Annular Ring

Annulus

AOI automatic optical inspection

Aperture

Arc

Array

assembly

AutoCAD

autorouter

Autotrax

Autotrax

AXI automated x-ray inspection

Axial

Bakelite

BGA

Blind Via

bloat

board house

Board Thickness

Breadboard

buffer

Buried Via

bus

C4 Controlled collapse chip connection

CAD

CAM files

CAM

Capture

Card Edge connector

Castellations

CEM-1

CEM-3

Centroid

centroid

Chip Scale Package

clad

Clearance

Coating (Spin, Roll, Film)

COB

Component Side

Component

Computer Aided Design

Computer Aided Machining

Conformal Coating

Conformal coating

connect

Copper Foil

Copper weight

Copper

copper

courtyard

cte coefficient of thermal expansion (see tce)

Curve, open

delamination

DFSM Dry film soldermask

Dialectric

Diameter

Dielectric

differential pair

DIP

Discrete Component

double-sided

DRC design rule check

Drill file

Eagle

EDF

EDI Electronic Data Interchange

Endpoint

ENIG Electroless Nickel Immersion Gold

epoxy resin

ESD Electrostatic Discharge

Etching

Excellon

explicit layer

fabrication fab

Feedthrough Via

fidocad

Fiducial

Finger

Finite Element Filter

Fixture

flags

Flex

Flip chip

flood fill

Flux

Flying probe

Foil

font

Footprint

FR-1

FR-2

FR-3

FR-4

Gcode

gEDA

Gerber

grid snap

grid-pitch

grid

Hard Gold pcb surface finish (slip rings, fingers, etc)

HASL Hot Air surface levelling

High Density Interconnect(HDI)

Hole

Immersion Silver

Immersion Tin

implicit layer

Integrated Circuit

IPC (circa 1957)

JIT

Kapton

KiCAD

Knife

Laminate

Land

Laser

Layer Group

Layer Sequence

Layers (Physical)

Layers (Virtual)

Library

Lihata

mask

Masonite

Mentor

Mil

Milling

milling

Mirroring

Mouse bites

Multilayer

neckdown

negative process

Negative transfer

NEMA

Net

Netlist

ODB++

OrCAD

OSP Organic Solderability preservative

outline

Package

Pad

padstack

Panel Service

panel

Panelization

paste stencil

paste

Path

pcb-rnd

PCB

PDIP

phenolic resin

Photoengraving

Photoresist

pick and place pnp

Pin

pinout

pitch

PLCC plastic lead chip carrier

plotter

Polygon hole

Polygon, complex

Polygon, concave

Polygon, convex

Polygon, irregular

Polygon, regular

Polygon, simple

Polygon

polygon

positive process

Positive transfer

Protel

PTH

Pyralux AP

Pyralux FR

Pyralux LF

QFP

Radial Lead

Raster

rat

Ratsnest

refdes Reference Designator, https://en.wikipedia.org/wiki/Reference_designator

reflow

Registration

resin

resist

RF

Rigid-Flex

Route and Retain

routing style

Routing

routing

RS-274D

RS-274X

Rubylithe

Scoring

Short

Silk Screen

Silk

silk

single-sided

SIP

slot

SMD

SMOBC soldermask over bare copper
prevent unintended flow of tin/lead during reflow

SMT

Snap

SOIC

Solder Side

Solder

STEP

Subcircuit

Substrate

Subtractive

Symbol

Tape out

TCE thermal coefficient of expansion

tEDAx

Tented(Via)

terminal

TG Glass transition temp

Thermal Via Thermal relief

Thou

Tin Whisker

Tin

TinyCAD

Tolerance

tombstone

tooling

toolpath generator

toolpath

toporouter

Trace

TT toner transfer

V-Cut
aka v-scoring

V-score

Vcc

Vdd

Vector

Via stitching

Via

Wave Solder

Wire bonding

XY